The AI Buildout Bottlenecks
What does it take to scale AI infrastructure to meet growing demand?
Hear from the people who are actually building the industry, from hyperscalers to financers to chip designers, as they discuss this very problem across the full stack – from how data centers get built, to what happens inside them, and all the way down to the silicon layer.
Hosted by Earth & Beyond Ventures, Silicon Catalyst, and Arnon Tadmor-Levy.
Confirmed Speakers:
Kohavit Baliti Levy, EMEA Sales & BD, TSMC
Ido Bukspan, VP Silicon Engineering of Networking, Google
Robert Elkins, VP of Optical Connectivity, Corning
Omri Geller, VP Product, DSX-OS Platform SW, Nvidia
Roi Bar-Kat, Israel Head, Intel Capital
Sharon Hatzor, VP Strategy, Israel Ministry of Energy
Yacine Saidji, MD & Europe Co-Head, Morgan Stanley Infrastructure Partners
Moshe Zalcberg, Managing Partner Israel, Silicon Catalyst
Zack Fagan, General Partner, Earth & Beyond Ventures
Agenda:
Gathering & Networking
Opening Remarks
Panel 1: Building the Data Center: Capital, Energy, & Regulation
Panel 2: Inside the Data Center: Power, Cooling, & Connectivity
Panel 3: The Silicon Core: Chips, Materials & Future Compute
Closing Remarks & Networking
*The agenda is subject to change.