Advanced Packaging Panel & Social Hour in Boston

​Join Ajinomoto Group Ventures and Cambium Capital on September 30 during the IMAPS Symposium 2026 in Boston for a deep dive into investing in AI and advanced semiconductor packaging.

​Enjoy an afternoon connecting with fellow investors, industry experts, and startups over delicious bites and drinks, at our event, located just a short drive away from the IMAPS Symposium. RSVP and approval required to attend.

​Panelists:

​Isabel Klein, PhD, Principal at M Ventures

​Christian Gallagher, General Partner at Socratic Partners

​Daniel Franke, PhD, General Partner at Cambium Capital

​Habib Hichri, PhD, Executive Vice President and Senior Fellow at Ajinomoto Fine-Techno

As scaling AI compute moves from transistor- and chip-level towards scaling of large, interconnected systems, advanced semiconductor packaging is becoming a key bottleneck. TSMC, for example, has repeatedly signaled that advanced packaging capacity, rather than wafer fabrication, has become one of the key constraints on AI accelerator deployment.

Industry leaders increasingly view chiplets and emerging packaging platforms as a path to overcoming the economic and physical limitations of building ever-larger monolithic chips. Will that open the market to more innovators, or will integration complexity ultimately strengthen incumbents?

Advanced packaging performance increasingly depends on thermal management, reliability, electrical performance, and specialized materials rather than semiconductor process technology alone. Are materials becoming the most underappreciated source of competitive advantage?