Designing Electronics Hardware Packaging for Heat, EMI, and Scale

​Curious about the types of designs enabled by controlled, low shear polymer processing? If warp, heat, or fragile electronics define your design envelope, this workshop examines a new molding process built specifically for those constraints.

​The session focuses on three things: limitations of traditional injection molding, what changes under a low-pressure, low-shear regime, and how those changes open new design space for modern hardware.

​Topics include:

• ​Rapid production tooling and broader materials access

• ​Using thermal performance as a design lever

• ​Stress-free molding for complex geometries

• ​In-situ compounding for high-performance materials

  • ​How to blend fibers, fillers, or powders at the machine to reach mechanical properties beyond standard pre-compounded resins.

​​​​​About X2F Manufacturing

​X2F is a next-generation molding and material-processing platform for advanced manufacturing. Our technology uses controlled, low-pressure material flow to mold high-viscosity, thermally conductive, and fiber-filled polymers that conventional injection molding can’t process.

​About Hardware FYI

​Hardware FYI is a weekly newsletter for engineers, founders, and operators building at the intersection of hardware and manufacturing. We cover the latest in engineering and startup funding, with technical insights trusted by 17,500+ subscribers.