![Cover Image for [RSVP] Securing the Silicon Future: Taiwan-Czechia Semiconductor Security Launch](https://images.lumacdn.com/cdn-cgi/image/format=auto,fit=cover,dpr=2,background=white,quality=75,width=400,height=400/event-covers/gv/ac2bdf7c-67fb-4ef3-8705-898b8a0fc3c5.png)
[RSVP] Securing the Silicon Future: Taiwan-Czechia Semiconductor Security Launch
We are honored to invite you to witness a milestone in the Taiwan-Czechia semiconductor collaboration. As we officially launch the Jmem Tek Czech Office, we look forward to fostering meaningful dialogues and exploring new horizons in semiconductor security and resilient supply chain solutions with our valued industry partners.
Date: April 17, 2026, Friday
Time: 13:30 – 16:30 (Registration starts at 13:30)
Venue: 布爾諾理工大學校本部大禮堂(Dyorana VUT Rectorate), Antoninska 548/1, 602 00 Brno, Czech Republic
Highlights:
Strategic MOU Signing: Jmemtek & Czech National Semiconductor Cluster (CNSC).
Grand Opening: Official launch of Jmemtek’s Czech operational footprint.
Technical Showcase: Security chip applications for UAV and Satellite defense systems.
Networking: Facilitating business matchmaking between Taiwan and Czech Republic.
Supported by:
Ministry of Foreign Affairs, ROC (Taiwan)
National Science and Technology Council (NSTC)
National Institutes of Applied Research (NIAR)
CzechInvest
Czech National Semiconductor Cluster (CNSC)
RSVP: Please confirm your attendance by signing up here.
For inquiries, please contact: Dana Liu, Public Affiars Project Manager, Jmem Tek, [email protected]